描述
Intelligent equipment:
1. Integrate upper and lower 3D cameras to realize the inspection requirements of appearance defects, electrode size, flatness, thickness, etc.;
2. Continuous defect monitoring and inspection to avoid large-scale defective production with barcode scanning gun; automatic line change (optional function);
3. With the function of connecting with the manufacturing execution system (ES), production information can be uploaded in real time;
Application
Semiconductor IC, integrated inductor coplanarity detection, new product development small batch use.
参数